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There is a specific focus on the role of gold in bonding wire. With the rising price of gold, many companies are looking to switch to copper. The publication looks at the advantages and difficulties with using copper wir..
09 Oct 2010
Gold Bulletin highlights the current and future uses of gold in the industry London. The World Gold Council (WGC) has published a special issue of Gold Bulletin devoted to the use of gold in electronics. This edition covers current technological uses of the metal such as in gold bonding wire and electroplating, as well as some emerging future applications of gold in advanced electronics. These include the use of gold nanoparticles to enhance the capacity of flash memory devices and in novel printed gold inks for low temperature printing applications. Contributors to the special issue include researchers from leading industrial and academic centres.

Dr Richard Holliday, Director, Technology at the World Gold Council and Editor of Gold Bulletin said: "This publication highlights the importance of electronics to the gold market. Since 1980, over 5,600 tonnes of gold have been used by manufacturers of electronic and electrical goods. Current annual demand for gold by these manufacturers constitutes about 8% of total demand. Gold and the electronics industry continue to be very much interconnected".

Printed gold inks for electronic applications

The publication looks at novel printed gold inks for electronic applications, developed by Johnson Matthey. The use of flexible substrates, which are plastics and other materials that can be used to print electronics onto, creates a wealth of possibilities for the manufacture of low cost, highly functional, intelligent materials. Applications of energy efficient, lightweight, flexible devices are myriad; a recent report has valued the market for printed and thin film electronics at $1.92 billion in 2009 and this is predicted to grow to $335 billion by 2029.

Recent progress in gold nanoparticle-based non-volatile memory devices Gold Bulletin looks at the recent progress in gold nanoparticle-based non-volatile memory devices. Specifically, it investigates the recent advances in fabrication and characterization of gold nanoparticle-based non-volatile memory devices, with an emphasis on flash memory-type devices.

What is the future of bonding wire? Will copper entirely replace gold?

There is a specific focus on the role of gold in bonding wire. With the rising price of gold, many companies are looking to switch to copper. The publication looks at the advantages and difficulties with using copper wire advance packaging, explaining why copper cannot replace gold in many applications as well as the significant benefits of gold to safety critical applications. This article follows on from a survey conducted by SEMI (the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries) in January this year, which highlighted the concerns that the semi-conductor industry has regarding the use of copper wire within their products.

Dr Holliday continued: "The rapid nature of development in electronics means that it is almost impossible to predict the future usage of gold. Both price and the types of consumer electronics that emerge in the next decade will influence the trajectory of gold in the electronics market. What we can say, however, is that gold will continue to play a key role in an industry where durability, reliability and performance must be trusted".

Courtesy: Gem & Jewellery Export Promotion Council, India
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Ohit gupta
15 Oct 2010
how will trading online
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